Comparative Analysis of Fracture Strength of Slurry and Diamond Wire Sawn Multicrystalline Silicon Solar Wafers

Mechanical Strength of Silicon Wafers Cut by Loose Abrasive Slurry and Fixed Abrasive Diamond Wire Sawing

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Study of Ductile-to-Brittle Transition in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers

(2012) Hao Wu et al.   JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME

Effect of crystallographic orientation on ductile scribing of crystalline silicon: Role of phase transformation and slip

(2012) Hao Wu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effect of debris on the silicon wafering for solar cells

(2011) A. Bidiville et al.   SOLAR ENERGY MATERIALS AND SOLAR CELLS

Thin Czochralski silicon solar cells based on diamond wire sawing technology

(2011) Xuegong Yu et al.   SOLAR ENERGY MATERIALS AND SOLAR CELLS

Characterization of polycrystalline silicon wafers for solar cells sliced with novel fixed-abrasive wire

(2010) N. Watanabe et al.   PROGRESS IN PHOTOVOLTAICS

Mechanisms of wafer sawing and impact on wafer properties

(2010) A. Bidiville et al.   PROGRESS IN PHOTOVOLTAICS

Strength of silicon wafers: fracture mechanics approach

(2009) Przemyslaw Rupnowski et al.   INTERNATIONAL JOURNAL OF FRACTURE

Phase transformations in (111) Si after spherical indentation

(2009) Ayesha J. Haq et al.   JOURNAL OF MATERIALS RESEARCH