Electrodeposit copper from alkaline cyanide-free baths containing 5,5′-dimethylhydantoin and citrate as complexing agents

Galvanostatic Stripping Chronopotentiometric Study for Determination of Selenium: Pharmacokinetic Application in Experimental Mice

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A Combined Theoretical and Experimental Study for Silver Electroplating

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Reactive Dynamics Simulation of Monolayer and Multilayer Adsorption of Glycine on Cu(110)

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Electrochemical copper deposition from an ethaline-CuCl2·2H2O DES

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Adsorption and inhibition effect of 2-thiohydantoin on mild steel corrosion in 0.1M HCl

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Prediction of a new leveler (N-butyl-methyl piperidinium bromide) for through-hole electroplating using molecular dynamics simulations

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Electrodeposition of copper into trenches from a citrate plating bath

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Electrochemical behavior of gold (III) in cyanide-free bath with 5,5′-dimethylhydantoin as complexing agent

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Initial stages of the electrocrystallization of copper from non-cyanide alkaline bath containing glycine

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New environmentally friendly noncyanide alkaline electrolyte for copper electroplating

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