Reactive Metal Bonding of Carbon Nanotube Arrays for Thermal Interface Applications
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Title
Reactive Metal Bonding of Carbon Nanotube Arrays for Thermal Interface Applications
Authors
Keywords
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Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Volume 4, Issue 12, Pages 1906-1913
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2014-11-21
DOI
10.1109/tcpmt.2014.2369371
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