Fizeau-type interferometric probe to measure geometrical thickness of silicon wafers

Optical interferometric approach for measuring the geometrical dimension and refractive index profiles of a double-sided polished undoped Si wafer

(2014) Ho-Jae Lee et al.   MEASUREMENT SCIENCE and TECHNOLOGY

Measurement of thickness profile and refractive index variation of a silicon wafer using the optical comb of a femtosecond pulse laser

(2013) Jungjae Park et al.   OPTICS COMMUNICATIONS

Modified Roberts-Langenbeck test for measuring thickness and refractive index variation of silicon wafers

(2012) Jungjae Park et al.   OPTICS EXPRESS

Precision depth measurement of through silicon vias (TSVs) on 3D semiconductor packaging process

(2012) Jonghan Jin et al.   OPTICS EXPRESS

Uncertainty improvement of geometrical thickness and refractive index measurement of a silicon wafer using a femtosecond pulse laser

(2012) Saerom Maeng et al.   OPTICS EXPRESS

Thickness and refractive index measurement of a silicon wafer based on an optical comb

(2010) Jonghan Jin et al.   OPTICS EXPRESS

An uncertainty evaluation for multiple measurements by GUM, III: using a correlation coefficient

(2008) Gyeonghee Nam et al.   ACCREDITATION AND QUALITY ASSURANCE