Growth of large-scale nanotwinned Cu nanowire arrays from anodic aluminum oxide membrane by electrochemical deposition process: controllable nanotwin density and growth orientation with enhanced electrical endurance performance

Modulation of Crystallographic Texture and Twinning Structure of Cu Nanowires by Electrodeposition

(2013) Chien-Neng Liao et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Thermal stability of highly nanotwinned copper: The role of grain boundaries and texture

(2012) Yifu Zhao et al.   JOURNAL OF MATERIALS RESEARCH

Deformation mechanisms in nanotwinned metal nanopillars

(2012) Dongchan Jang et al.   Nature Nanotechnology

Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

(2012) H.-Y. Hsiao et al.   SCIENCE

Manipulating the Crystallographic Texture of Nanotwinned Cu Films by Electrodeposition

(2011) Tsung-Cheng Chan et al.   CRYSTAL GROWTH & DESIGN

Electrical Breakdown of Nanowires

(2011) Jiong Zhao et al.   NANO LETTERS

Deformation twinning in nanocrystalline materials

(2011) Y.T. Zhu et al.   PROGRESS IN MATERIALS SCIENCE

Surface and grain-boundary scattering in nanometric Cu films

(2010) Tik Sun et al.   PHYSICAL REVIEW B

Correlation between a threshold failure time and void nucleation for describing the bimodal electromigration behavior of copper interconnects

(2009) R. G. Filippi et al.   APPLIED PHYSICS LETTERS

Direct detection of grain boundary scattering in damascene Cu wires by nanoscale four-point probe resistance measurements

(2009) Yusuke Kitaoka et al.   APPLIED PHYSICS LETTERS

Significant enhancement of the strength-to-resistivity ratio by nanotwins in epitaxial Cu films

(2009) O. Anderoglu et al.   JOURNAL OF APPLIED PHYSICS

Anin situinvestigation of electromigration in Cu nanowires

(2009) Qiaojian Huang et al.   NANOTECHNOLOGY

Revealing the Maximum Strength in Nanotwinned Copper

(2009) L. Lu et al.   SCIENCE

Nanoscale Twinned Copper Nanowire Formation by Direct Electrodeposition

(2009) Sheng Zhong et al.   Small

Surface and size effects on the electrical properties of Cu nanowires

(2008) Qiaojian Huang et al.   JOURNAL OF APPLIED PHYSICS

Thermal stability of sputtered Cu films with nanoscale growth twins

(2008) O. Anderoglu et al.   JOURNAL OF APPLIED PHYSICS

Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper

(2008) K.-C. Chen et al.   SCIENCE