The fabrication of back etching 3C-SiC-on-Si diaphragm employing KOH + IPA in MEMS capacitive pressure sensor

Published 2014 View Full Article

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Title
The fabrication of back etching 3C-SiC-on-Si diaphragm employing KOH + IPA in MEMS capacitive pressure sensor
Authors
Keywords
Etching Process, Average Surface Roughness, Etch Depth, Bulge Test, Ethyl Lactate
Journal
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
Volume 21, Issue 8, Pages 1651-1661
Publisher
Springer Nature
Online
2014-08-04
DOI
10.1007/s00542-014-2267-8
References
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