The fabrication of back etching 3C-SiC-on-Si diaphragm employing KOH + IPA in MEMS capacitive pressure sensor

标题
The fabrication of back etching 3C-SiC-on-Si diaphragm employing KOH + IPA in MEMS capacitive pressure sensor
作者
关键词
Etching Process, Average Surface Roughness, Etch Depth, Bulge Test, Ethyl Lactate
出版商
Springer Nature
发表日期
2014-08-04
DOI
10.1007/s00542-014-2267-8

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