4.5 Article

Three-Dimensional Analysis of Carbon Nanotube Networks in Interconnects by Electron Tomography without Missing Wedge Artifacts

Journal

MICROSCOPY AND MICROANALYSIS
Volume 16, Issue 2, Pages 210-217

Publisher

CAMBRIDGE UNIV PRESS
DOI: 10.1017/S1431927609991371

Keywords

electron tomography; carbon nanotubes; missing wedge; FIB; TEM; patterned nanostructures

Funding

  1. European Union [NMP4-CT-2006-016475]
  2. FWO [G.0180.08]
  3. Belgian government

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The three-dimensional (3D) distribution of carbon nanotubes (CNTs) grown inside semiconductor contact holes is studied by electron tomography. The use of a specialized tomography holder results in an angular tilt range of +/-90 degrees which means that the so-called missing wedge is absent. The transmission electron microscopy (TEM) sample for this purpose consists of a micropillar that is prepared by a dedicated procedure using the focused ion beam (FIB) but keeping the CNTs intact. The 3D results are combined with energy dispersive X-ray spectroscopy (EDS) to study the relation between the CNTs and the catalyst particles used during their growth. The reconstruction, based on the full range of tilt angles, is compared with a reconstruction where a missing wedge is present. This clearly illustates that the missing wedge will lead to an unreliable interpretation and will limit quantitative studies.

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