Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics

Published 2009 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 49, Issue 8, Pages 853-860
Publisher
Elsevier BV
Online
2009-04-11
DOI
10.1016/j.microrel.2009.03.013

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.