Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics

标题
Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics
作者
关键词
-
出版物
MICROELECTRONICS RELIABILITY
Volume 49, Issue 8, Pages 853-860
出版商
Elsevier BV
发表日期
2009-04-11
DOI
10.1016/j.microrel.2009.03.013

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