Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder

标题
Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder
作者
关键词
-
出版物
MATERIALS & DESIGN
Volume 55, Issue -, Pages 574-582
出版商
Elsevier BV
发表日期
2013-10-24
DOI
10.1016/j.matdes.2013.10.033

向作者/读者发起求助以获取更多资源

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started