Thermal conductivity and fire resistance of epoxy molding compounds filled with Si3N4 and Al(OH)3

Published 2011 View Full Article

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Title
Thermal conductivity and fire resistance of epoxy molding compounds filled with Si3N4 and Al(OH)3
Authors
Keywords
-
Journal
MATERIALS & DESIGN
Volume 34, Issue -, Pages 820-824
Publisher
Elsevier BV
Online
2011-07-23
DOI
10.1016/j.matdes.2011.07.012

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