Thermal conductivity and fire resistance of epoxy molding compounds filled with Si3N4 and Al(OH)3

标题
Thermal conductivity and fire resistance of epoxy molding compounds filled with Si3N4 and Al(OH)3
作者
关键词
-
出版物
MATERIALS & DESIGN
Volume 34, Issue -, Pages 820-824
出版商
Elsevier BV
发表日期
2011-07-23
DOI
10.1016/j.matdes.2011.07.012

向作者/读者发起求助以获取更多资源

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now