Effect of copper content on the thermal conductivity and thermal expansion of Al–Cu/diamond composites

Title
Effect of copper content on the thermal conductivity and thermal expansion of Al–Cu/diamond composites
Authors
Keywords
-
Journal
MATERIALS & DESIGN
Volume 39, Issue -, Pages 87-92
Publisher
Elsevier BV
Online
2012-02-25
DOI
10.1016/j.matdes.2012.02.029

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