Effect of copper content on the thermal conductivity and thermal expansion of Al–Cu/diamond composites

出版年份 2012 全文链接

标题

作者

关键词

出版物

Volume 39, Issue -, Pages 87-92

出版商

Elsevier BV

发表日期

2012-02-25

DOI

10.1016/j.matdes.2012.02.029

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