Fabrication and characterization of robust through-silicon vias for silicon-carrier applications

Published 2010 View Full Article

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Title
Fabrication and characterization of robust through-silicon vias for silicon-carrier applications
Authors
Keywords
-
Journal
IBM JOURNAL OF RESEARCH AND DEVELOPMENT
Volume 52, Issue 6, Pages 571-581
Publisher
IBM
Online
2010-04-06
DOI
10.1147/jrd.2008.5388558

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