Article
Materials Science, Multidisciplinary
Fan Xu, Weilei Wang, Aoxue Xu, Daohuan Feng, Weili Liu, Zhitang Song
Summary: The effects of particle size and pH of SiO2-based slurry on chemical mechanical polishing for SiO2 film were investigated. It was found that particle size and pH had significant impacts on removal rates and surface roughness. The main polishing mechanism involved providing activation energy for mechanical erasure, and pH affected the particle size and Zeta potential, thereby influencing the strength of mechanical and chemical action.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2022)
Article
Engineering, Electrical & Electronic
Samrina Sahir, Hwi-Won Cho, Palwasha Jalalzai, Suprakash Samanta, Satomi Hamada, Tae-Gon Kim, Jin-Goo Park
Summary: PVA brush scrubbing is a widely used post-CMP cleaning process. This study investigated the effects of abrasive types, slurry pH, and scrubbing process parameters on brush contamination. The results showed that brush contamination is more sensitive to the abrasive nature and concentration, the slurry pH, and the process time than to other parameters.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
(2022)
Article
Materials Science, Multidisciplinary
Mohit Sharma, Chao-Chang A. Chen
Summary: This paper investigates the nanomechanical properties of copper thin film and reacted passivation layer on a silicon wafer in different environmental conditions using nanoindentation. The results show changes in nanohardness and Young's modulus of the materials in different environments, which are critical for the analysis and modeling of the chemical mechanical planarization (CMP) process.
ADVANCES IN MATERIALS AND PROCESSING TECHNOLOGIES
(2022)
Article
Materials Science, Multidisciplinary
Bhupinder Singh, Sunny Zafar
Summary: The study investigated the effect of high temperature heat treatment on the microstructure and erosive wear performance of Ni-based clad. It was found that heat treatment at 750 degrees C led to increased erosion resistance.
Article
Materials Science, Multidisciplinary
Shuangshuang Lei, Shengli Wang, Hongliang Li, Chenwei Wang, Yundian Yang, Yuanshen Cheng, Sen Li
Summary: This study investigated the passivation mechanism of three azole inhibitors on cobalt, with 1-H carboxyl benzotriazole (CBT) showing the strongest passivation effect. Analysis suggested that the carboxyl group on CBT played a crucial role in preventing cobalt oxidation. Furthermore, the presence of methyl on 5-methyl-benzotriazole (TTA) led to better passivation effect compared to benzotriazole (BTA).
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2021)
Article
Engineering, Electrical & Electronic
Nengyuan Zeng, Yuling Liu, Yuanshen Cheng, Chong Luo, Hongdong Zhao
Summary: The efficient removal of copper in the multi-layer copper interconnect copper film chemical mechanical planarization (CMP) process is crucial for the high production efficiency of integrated circuit process. This paper investigates the effect of adding potassium sulfate (K2SO4) in polishing slurries on the copper removal rate. The study explores the mechanism of K2SO4 enhancement through characterization experiments, including electrochemical analysis, X-ray photoelectron spectroscopy (XPS), and laser scanning confocal microscope (LSCM) imaging.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
(2023)
Article
Engineering, Mechanical
Song Yuan, Xiaoguang Guo, Ming Li, Zhuji Jin, Dongming Guo
Summary: Oxidants play a crucial role in the final surface quality and removal rate during CMP. This study presents a new polishing slurry based on Fenton reaction, achieving high quality and efficiency removal of diamond.
TRIBOLOGY INTERNATIONAL
(2022)
Article
Engineering, Manufacturing
Zhenyu Zhang, Jie Liu, Wei Hu, Lezhen Zhang, Wenxiang Xie, Longxing Liao
Summary: The novel green CMP technique effectively reduces the surface roughness of sapphire, achieving lower material removal rates and processing times, providing new perspectives for the semiconductor and microelectronic industries.
JOURNAL OF MANUFACTURING PROCESSES
(2021)
Article
Materials Science, Coatings & Films
Zefei Zhang, Hao Bai, Hao Chen, Huanmei Yuan, Lihong Li, Min Zhong
Summary: The slurry method was used to form a ceramic coating on copper with a NiCoCrAlY transition layer. The optimization of the raw materials and particle size composition played a crucial role in improving the performance of the coating.
SURFACE & COATINGS TECHNOLOGY
(2021)
Article
Materials Science, Multidisciplinary
Xiaofan Yang, Baoguo Zhang, Zhaoxia Yang
Summary: This study investigates the influence of KHP and TAZ on cobalt corrosion and Co/Cu surface finishing. The experiments show that the addition of KHP and TAZ can effectively reduce cobalt corrosion and improve the surface roughness of Co/Cu.
MATERIALS CHEMISTRY AND PHYSICS
(2022)
Article
Engineering, Chemical
Zhuen Ruan, Aixiang Wu, Raimund Burger, Fernando Betancourt, Yiming Wang, Yong Wang, Huazhe Jiao, Shengkai Wang
Summary: Gravity thickening by deep cone thickener is widely used in cemented paste backfill, which is essential for tailings management and green mining. The concentration and flowability of the thickened tailings slurry depend critically on the yield stress of the slurry, which in turn can be influenced by the flocculant dosage and pH values. Adjusting the interparticle interactions through control of pH and flocculant dosage is essential to achieve high-concentration and high-flowability underflow and avoid rake bogging in a deep cone thickener.
Article
Materials Science, Multidisciplinary
Aoxue Xu, Fan Xu, Weilei Wang, Weili Liu, Zhitang Song
Summary: The study demonstrates that diethanolamine (DEA) can effectively inhibit the removal rate of cobalt and reduce surface scratches during chemical mechanical polishing. The inhibition types of DEA are mainly physical and chemical adsorption. Additionally, XPS analysis shows that DEA forms a water-insoluble Co-DEA complex by complexing cobalt ions.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2021)
Article
Materials Science, Multidisciplinary
Yan Zhou, Haimei Luo, Gaopan Chen, Guihai Luo, Liyan Pan, Guoshun Pan
Summary: A method for improving the removal efficiency and surface quality of SiC wafers through photocatalysis-assisted chemical mechanical polishing has been developed, and it has been demonstrated that the addition of SiO2@TiO2 composite nanoparticles in the slurry is more effective for surface polishing.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2023)
Article
Chemistry, Physical
Samrina Sahir, Nagendra Prasad Yerriboina, So-Young Han, Kwang-Min Han, Tae-Gon Kim, Niraj Mahadev, Jin-Goo Park
Summary: The research found that the removal of ceria particles is more difficult under certain pH conditions, and only specific chemical cleaning methods are effective in removing ceria particles.
APPLIED SURFACE SCIENCE
(2021)
Article
Chemistry, Physical
Wantang Wang, Baoguo Zhang, Yunhui Shi, Jiakai Zhou, Ru Wang, Nengyuan Zeng
Summary: The study combines mixed abrasive slurry (MAS) with photocatalytic effect in the SiC-CMP process to achieve efficient enhanced CMP technology. By using MAS consisting of Al2O3 and ZrO2 abrasives, a high material removal rate and surface roughness can be obtained under UV irradiation.
APPLIED SURFACE SCIENCE
(2022)