A low-temperature parylene-to-silicon dioxide bonding technique for high-pressure microfluidics

Title
A low-temperature parylene-to-silicon dioxide bonding technique for high-pressure microfluidics
Authors
Keywords
-
Journal
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 21, Issue 3, Pages 035011
Publisher
IOP Publishing
Online
2011-02-09
DOI
10.1088/0960-1317/21/3/035011

Ask authors/readers for more resources

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now