Wafer-level BCB bonding using a thermal press for microfluidics

Published 2008 View Full Article

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Title
Wafer-level BCB bonding using a thermal press for microfluidics
Authors
Keywords
-
Journal
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
Volume 15, Issue 4, Pages 573-580
Publisher
Springer Nature
Online
2008-10-23
DOI
10.1007/s00542-008-0712-2

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