Interfacial Characteristics and Dynamic Process of Au- and Cu-Wire Bonding and Overhang Bonding in Microelectronics Packaging
Published 2013 View Full Article
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Title
Interfacial Characteristics and Dynamic Process of Au- and Cu-Wire Bonding and Overhang Bonding in Microelectronics Packaging
Authors
Keywords
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Journal
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 22, Issue 3, Pages 560-568
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2013-05-30
DOI
10.1109/jmems.2012.2230316
References
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