Packaging and Non-Hermetic Encapsulation Technology for Flip Chip on Implantable MEMS Devices

Published 2012 View Full Article

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Title
Packaging and Non-Hermetic Encapsulation Technology for Flip Chip on Implantable MEMS Devices
Authors
Keywords
-
Journal
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 21, Issue 4, Pages 882-896
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2012-04-12
DOI
10.1109/jmems.2012.2190712

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