Interfacial Microstructures and Thermodynamics of Thermosonic Cu-Wire Bonding

Effect of ultrasonic energy on nanoscale interfacial structure in copper wire bonding on aluminium pads

(2011) H Xu et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

A micromechanism study of thermosonic gold wire bonding on aluminum pad

(2010) H. Xu et al.   JOURNAL OF APPLIED PHYSICS

Initial bond formation in thermosonic gold ball bonding on aluminium metallization pads

(2010) Hui Xu et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution

(2010) H. Xu et al.   MICROELECTRONICS RELIABILITY

Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound

(2010) Y.H. Tian et al.   MICROELECTRONICS RELIABILITY

Hardening and Softening in AlSi1 Bond Contacts During Ultrasonic Wire Bonding

(2009) U. Geissler et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminum Metallization

(2009) Hui Xu et al.   JOURNAL OF ELECTRONIC MATERIALS

A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads

(2009) H. Xu et al.   SCRIPTA MATERIALIA

Application of Underfill for Flip-Chip Package Using Ultrasonic Bonding

(2008) Bo-In Noh et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature

(2008) Yanhong Tian et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Nano features of Al/Au ultrasonic bond interface observed by high resolution transmission electron microscopy

(2008) Hongjun Ji et al.   MATERIALS CHARACTERIZATION

Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging

(2007) C.J. Hang et al.   MICROELECTRONICS RELIABILITY