Fluxless bonding of Si chips to aluminum boards using electroplated Sn solder

标题
Fluxless bonding of Si chips to aluminum boards using electroplated Sn solder
作者
关键词
Bonding Process, Bonding Pressure, Fracture Force, Joint Thickness, Bonding Design
出版物
出版商
Springer Nature
发表日期
2014-05-19
DOI
10.1007/s10854-014-2014-z

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