Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn–3.5Ag solder joints

Published 2009 View Full Article

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Title
Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn–3.5Ag solder joints
Authors
Keywords
-
Journal
ACTA MATERIALIA
Volume 57, Issue 17, Pages 5001-5012
Publisher
Elsevier BV
Online
2009-08-03
DOI
10.1016/j.actamat.2009.06.060

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