Study of Ductile-to-Brittle Transition in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers

Published 2012 View Full Article

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Title
Study of Ductile-to-Brittle Transition in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers
Authors
Keywords
-
Journal
JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME
Volume 134, Issue 4, Pages 041011
Publisher
ASME International
Online
2012-09-05
DOI
10.1115/1.4006177
References
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