Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer

Published 2009 View Full Article

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Title
Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer
Authors
Keywords
-
Journal
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
Volume 48, Issue 9-12, Pages 993-999
Publisher
Springer Nature
Online
2009-11-10
DOI
10.1007/s00170-009-2347-6

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