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Evidence of electric-field-accelerated growth of tin whiskers

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Effect of Crystal Orientation on Mechanically Induced Sn Whiskers on Sn-Cu Plating

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Fracture Behavior of Sn-3.5Ag-0.7Cu and Pure Sn Solders as a Function of Applied Strain Rate

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Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

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Effect of strongly oxidizing environment on whisker growth form tin coating

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Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders

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Poisson's ratio and plasticity in CuZrAl bulk metallic glasses

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