Three Dimensional Characterization of Tin Crystallography and Cu6Sn5 Intermetallics in Solder Joints by Multiscale Tomography

Electromigration mechanisms in Sn-0.7Cu/Cu couples by four dimensional (4D) X-ray microtomography and electron backscatter diffraction (EBSD)

(2016) J.C.E. Mertens et al.   ACTA MATERIALIA

Stochastic Multi-Scale Reconstruction of 3D Microstructure Consisting of Polycrystalline Grains and Second-Phase Particles from 2D Micrographs

(2015) Shaohua Chen et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

In situ fixture for multi-modal characterization during electromigration and thermal testing of wire-like microscale specimens

(2015) James C.E. Mertens et al.   MICROELECTRONICS RELIABILITY

Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy

(2013) H.X. Xie et al.   JOURNAL OF ELECTRONIC MATERIALS

Cyclic twin nucleation in tin-based solder alloys

(2010) L.P. Lehman et al.   ACTA MATERIALIA

Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders

(2009) M.A. Dudek et al.   ACTA MATERIALIA

Size and Volume Effects on the Strength of Microscale Lead-Free Solder Joints

(2009) L.M. Yin et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

(2008) Minhua Lu et al.   APPLIED PHYSICS LETTERS