Characterization of Wafer-Level Au-In-Bonded Samples at Elevated Temperatures

Published 2015 View Full Article

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Title
Characterization of Wafer-Level Au-In-Bonded Samples at Elevated Temperatures
Authors
Keywords
-
Journal
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
Volume 46, Issue 6, Pages 2637-2645
Publisher
Springer Nature
Online
2015-03-31
DOI
10.1007/s11661-015-2865-9
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