Wafer-level SLID bonding for MEMS encapsulation

High-Density Large-Area-Array Interconnects Formed by Low-Temperature Cu/Sn–Cu Bonding for Three-Dimensional Integrated Circuits

(2012) M. R. Lueck et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

The Cu–Sn phase diagram, Part I: New experimental results

(2012) S. Fürtauer et al.   INTERMETALLICS

Development of Metallic Hermetic Sealing for MEMS Packaging for Harsh Environment Applications

(2012) Vivek Chidambaram et al.   JOURNAL OF ELECTRONIC MATERIALS

Low temperature transient liquid phase bonding of Au/Sn and Cu/Sn electroplated material systems for MEMS wafer-level packaging

(2012) S. Marauska et al.   MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS

Au-Sn SLID Bonding—Properties and Possibilities

(2011) Torleif A. Tollefsen et al.   METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE

Wafer-Level Cu/Sn to Cu/Sn SLID-Bonded Interconnects With Increased Strength

(2011) He Liu et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process

(2010) J.F. Li et al.   ACTA MATERIALIA

Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates

(2009) Jenn-Ming Song et al.   MATERIALS TRANSACTIONS

Effect of bonding temperature on microstructure development during TLP bonding of a nickel base superalloy

(2008) M. Pouranvari et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Wafer level packaging of MEMS

(2008) Masayoshi Esashi   JOURNAL OF MICROMECHANICS AND MICROENGINEERING