Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking

Title
Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 37, Issue 8, Pages 1095-1101
Publisher
Springer Nature
Online
2008-05-31
DOI
10.1007/s11664-008-0487-3

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