Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging

Published 2007 View Full Article

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Title
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 48, Issue 3, Pages 416-424
Publisher
Elsevier BV
Online
2007-08-14
DOI
10.1016/j.microrel.2007.06.008

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