Article
Engineering, Electrical & Electronic
Austin Lee Hickman, Reet Chaudhuri, Samuel James Bader, Kazuki Nomoto, Lei Li, James C. M. Hwang, Huili Grace Xing, Debdeep Jena
Summary: The shift to the aluminum nitride platform offers smarter, highly-scaled heterostructure design to improve the performance of III-nitride amplifiers, enabling maximum high-power, high-speed potential for mm-wave communication and high-power logic applications.
SEMICONDUCTOR SCIENCE AND TECHNOLOGY
(2021)
Article
Engineering, Electrical & Electronic
Aniruddhan Gowrisankar, Vanjari Sai Charan, Hareesh Chandrasekar, Anirudh Venugopalarao, R. Muralidharan, Srinivasan Raghavan, Digbijoy N. Nath
Summary: This article reports the performance of compensation doping-free aluminum gallium-nitride (AlGaN)/gallium nitride (GaN) high-electron mobility transistors (HEMTs) on Silicon for RF applications using a polarization-graded buffer scheme. A resistive buffer is engineered using a compositionally reverse-graded AlGaN (g-AlGaN) layer, eliminating the need for compensation dopants. Transistors with 0.35 μm gate length and source-connected field plates showed a maximum drain current of 1 A/mm and OFF-state breakdown voltage of 144 V. RF performance of HEMTs on these polarization-graded buffers achieved a peak ft/fmax of 49.2/86.4 GHz.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2023)
Article
Materials Science, Multidisciplinary
Xia-Xi Zheng, Chun Wang, Jian-Hao Huang, Jen-Yao Huang, Daisuke Ueda, Krishna Pande, Chang Fu Dee, Ching Ting Lee, Edward-Yi Chang
Summary: This paper investigates the influence of group-III precursor injection rate on the material and electrical properties of InAlGaN/GaN heterostructures grown by Metalorganic Chemical Vapor Phase Deposition. It is demonstrated that high-quality GaN layers can be achieved by using the sputtered AlN/sapphire templates and optimized group-III injection rate, while maintaining high crystallinity and smooth surface of InAlGaN barrier layer.
Article
Physics, Applied
Xin Chen, Yaozong Zhong, Shumeng Yan, Xiaolu Guo, Hongwei Gao, Xiujian Sun, Haodong Wang, Fangqing Li, Yu Zhou, Meixin Feng, Ercan Yilmaz, Qian Sun, Hui Yang
Summary: The characteristics of an AlGaN/GaN high-electron-mobility transistor buffer structure are studied and optimized by employing an AlN/GaN superlattice (SL) structure. The influence of buffer traps on carrier transport behaviors and electrical performance for SL buffer structures under a high electric field is analyzed. The AlN/GaN SL buffer structures are further optimized with various AlN/GaN thickness ratios and their total thickness, achieving a high breakdown voltage and suppressing the buffer trapping effect.
JOURNAL OF PHYSICS D-APPLIED PHYSICS
(2023)
Article
Materials Science, Multidisciplinary
V. Hemaja, D. K. Panda
Summary: An n-polar GaN MIS-HEMT based biosensor is proposed for label-free detection of various bio-molecules by immobilizing the analytes in the underlap region to alter the electrostatic properties of the device, resulting in a significant increase in drain current and output conductance with the addition of different biomolecules in the nanocavity, with a maximum shift in threshold voltage observed for uricase due to its low dielectric constant.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2021)
Article
Engineering, Electrical & Electronic
Pragyey Kumar Kaushik, Sankalp Kumar Singh, Ankur Gupta, Ananjan Basu
Summary: This article investigates the effect of low gate bias on R-L in a small-signal model and shows that channel resistance has strong bias dependence. It is observed that R-L dominates above the threshold voltage and yields significant changes in drain-to-source resistance and capacitance. Matching the intrinsic Y-parameter, R-L is found to be important, with good agreement between simulated and measured S-parameters data up to 40 GHz.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2021)
Article
Engineering, Electrical & Electronic
Injun Hwang, Soogine Chong, Younghwan Park, Sun-Kyu Hwang, Boram Kim, Joonyong Kim, Jaejoon Oh, Jun Hyuk Park, Dong-Chul Shin, Min Chul Yu, Jai Kwang Shin, Jongseob Kim
Summary: This study focuses on the transient measurement of the drift region potential in AlGaN/GaN HEMT under high power state, revealing that the propagation speed of high electric field in the device is influenced by the drift region voltage, and proposing that trapping of hot channel electrons is causing this effect.
IEEE ELECTRON DEVICE LETTERS
(2021)
Article
Engineering, Electrical & Electronic
Pengfei Wan, Jianqun Yang, Hao Jiang, Yuanting Huang, Ling Lv, Lei Dong, Xiaoqing Yue, Bin Zhang, Gang Lin, Guojian Shao, Weiqi Li, Xiaodong Xu, Xiuhai Cui, Xingji Li
Summary: This article investigates the synergistic radiation effects on AlGaN/GaN high electron mobility transistors (HEMTs) under different irradiation conditions. The results show that HEMTs have excellent resistance to ionization radiation, but the drain current and carrier mobility decrease significantly under proton irradiation. The degradation rate caused by combined irradiation is three times higher than that caused by individual proton irradiation, indicating a synergistic effect between ionization and displacement effects.
IEEE TRANSACTIONS ON NUCLEAR SCIENCE
(2022)
Article
Engineering, Electrical & Electronic
Enrico Zanoni, Carlo De Santi, Zhan Gao, Matteo Buffolo, Mirko Fornasier, Marco Saro, Francesco De Pieri, Fabiana Rampazzo, Gaudenzio Meneghesso, Matteo Meneghini, Nicolo Zagni, Alessandro Chini, Giovanni Verzellesi
Summary: This article reviews various options for controlling short-channel effects, improving off-state characteristics, and reducing drain-source leakage current. The advantages and potential drawbacks of each proposed solution are analyzed in terms of current collapse, dispersion effects, and reliability.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2023)
Article
Computer Science, Information Systems
Wei Lin, Maojun Wang, Haozhe Sun, Bing Xie, Cheng P. Wen, Yilong Hao, Bo Shen
Summary: This paper proposes an HEMT structure with a source-connected p-GaN embedded in a carbon-doped semi-insulating buffer to suppress the buffer-induced current collapse effect. Two-dimensional transient simulation demonstrates the successful suppression of current collapse in SCPG-HEMTs compared to conventional HEMTs. The mechanism of ejecting holes from SCPG into the high resistive buffer layer after off-state stress is illustrated to potentially solve the buffer-induced degradation of dynamic on-resistance in GaN power devices.
Article
Physics, Applied
Akiyoshi Inoue, Sakura Tanaka, Takashi Egawa, Makoto Miyoshi
Summary: In this study, HFETs based on an Al0.36Ga0.64N-channel heterostructure with a dual AlN/AlGaInN barrier layer were successfully fabricated and characterized. The devices showed improved performance in terms of current density and breakdown voltage. Additionally, the devices adopting the dual AlN/AlGaInN barrier layer exhibited significantly smaller gate leakage currents.
JAPANESE JOURNAL OF APPLIED PHYSICS
(2022)
Article
Engineering, Electrical & Electronic
Fei Yang, Chi Xu, Bilal Akin
Summary: The article presents a technique to characterize threshold voltage shift in normally OFF gallium nitride (GaN) devices using beta-GaN gate technology. Experimental results show that the Vth increases by more than 50% within several microseconds under high drain voltage stress. The impact of the Vth shift on device performance is studied, suggesting that a high gate drive voltage and low gate resistance can mitigate the instability effect on p-GaN high-electron-mobility transistor's performance.
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS
(2021)
Article
Automation & Control Systems
Aaron Wadsworth, Matthew G. S. Pearce, Duleepa J. Thrimawithana
Summary: This article presents the design of a cryogenic gallium nitride (GaN) enhancement mode high-electron-mobility transistor (E-HEMT) synchronous buck converter, which achieves high efficiency and uses a nanocrystalline filter inductor within the cryogenic environment. The article also evaluates the selection of magnetic materials and litz wire at cryogenic temperatures. Cryogenically cooling the GaN switches reduces their losses by half compared to operating at room temperature under the same conditions.
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
(2023)
Article
Engineering, Electrical & Electronic
Jiabo Chen, Zhihong Liu, Haiyong Wang, Yue He, Xiaoxiao Zhu, Jing Ning, Jincheng Zhang, Yue Hao
Summary: In this study, a GaN complementary FET technology was monolithically integrated on a Si substrate, showing excellent noise margin and current density performance. These results demonstrate the great potential of this technology in the applications of GaN power modules.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2022)
Article
Engineering, Electrical & Electronic
Maher B. Tahhan, John A. Logan, Matthew T. Hardy, Mario G. Ancona, Brian Schultz, Brian Appleton, Thomas Kazior, David J. Meyer, Eduardo M. Chumbes
Summary: This article presents improvements in the large-signal RF power performance at the Ka-band of gallium nitride HEMTs utilizing a scandium aluminum nitride barrier. The results showed that silicon nitride as the passivation layer increased the gain and output power, but reduced the breakdown voltage. Adding an epitaxial aluminum gallium nitride passivating layer increased the maximum bias voltage that the devices can operate at.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2022)
Article
Engineering, Electrical & Electronic
Neil Moser, Jonathan McCandless, Antonio Crespo, Kevin Leedy, Andrew Green, Adam Neal, Shin Mou, Elaheh Ahmadi, James Speck, Kelson Chabak, Nathalia Peixoto, Gregg Jessen
IEEE ELECTRON DEVICE LETTERS
(2017)
Article
Engineering, Electrical & Electronic
Andrew Joseph Green, Kelson D. Chabak, Michele Baldini, Neil Moser, Ryan Gilbert, Robert C. Fitch, Guenter Wagner, Zbigniew Galazka, Jonathan McCandless, Antonio Crespo, Kevin Leedy, Gregg H. Jessen
IEEE ELECTRON DEVICE LETTERS
(2017)
Article
Physics, Applied
Yuewei Zhang, Adam Neal, Zhanbo Xia, Chandan Joishi, Jared M. Johnson, Yuanhua Zheng, Sanyam Bajaj, Mark Brenner, Donald Dorsey, Kelson Chabak, Gregg Jessen, Jinwoo Hwang, Shin Mou, Joseph P. Heremans, Siddharth Rajan
APPLIED PHYSICS LETTERS
(2018)
Editorial Material
Physics, Applied
Masataka Higashiwaki, Gregg H. Jessen
APPLIED PHYSICS LETTERS
(2018)
Article
Engineering, Electrical & Electronic
Kelson D. Chabak, Jonathan P. McCandless, Neil A. Moser, Andrew J. Green, Krishnamurthy Mahalingam, Antonio Crespo, Nolan Hendricks, Brandon M. Howe, Stephen E. Tetlak, Kevin Leedy, Robert C. Fitch, Daiki Wakimoto, Kohei Sasaki, Akito Kuramata, Gregg H. Jessen
IEEE ELECTRON DEVICE LETTERS
(2018)
Article
Physics, Applied
Adam T. Neal, Shin Mou, Subrina Rafique, Hongping Zhao, Elaheh Ahmadi, James S. Speck, Kevin T. Stevens, John D. Blevins, Darren B. Thomson, Neil Moser, Kelson D. Chabak, Gregg H. Jessen
APPLIED PHYSICS LETTERS
(2018)
Article
Multidisciplinary Sciences
Adam T. Neal, Shin Mou, Roberto Lopez, Jian V. Li, Darren B. Thomson, Kelson D. Chabak, Gregg H. Jessen
SCIENTIFIC REPORTS
(2017)
Article
Nanoscience & Nanotechnology
Kevin D. Leedy, Kelson D. Chabak, Vladimir Vasilyev, David C. Look, Krishnamurthy Mahalingam, Jeff L. Brown, Andrew J. Green, Cynthia T. Bowers, Antonio Crespo, Darren B. Thomson, Gregg H. Jessen
Proceedings Paper
Engineering, Electrical & Electronic
K. D. Chabak, D. E. Walker, A. J. Green, A. Crespo, M. Lindquist, K. Leedy, S. Tetlak, R. Gilbert, N. A. Moser, G. Jessen
2018 IEEE MTT-S INTERNATIONAL MICROWAVE WORKSHOP SERIES ON ADVANCED MATERIALS AND PROCESSES FOR RF AND THZ APPLICATIONS (IMWS-AMP)
(2018)
Proceedings Paper
Engineering, Electrical & Electronic
Gregg Jessen, Kelson Chabak, Andy Green, Jonathan McCandless, Steve Tetlakl, Kevin Leedy, Robert Fitch, Shin Mou, Eric Heller, Stefan Badescu, Antonio Crespo, Neil Moser
2017 75TH ANNUAL DEVICE RESEARCH CONFERENCE (DRC)
(2017)
Proceedings Paper
Engineering, Electrical & Electronic
Kelson Chabak, Andrew Green, Neil Moser, Steve Tetlakl, Jonathan McCandless, Kevin Leedy, Robert Fitch, Antonio Crespo, Gregg Jessen
2017 75TH ANNUAL DEVICE RESEARCH CONFERENCE (DRC)
(2017)
Proceedings Paper
Engineering, Electrical & Electronic
Gregg Jessen, Kelson Chabak, Andrew Green, Neil Moser, Jonathan McCandless, Kevin Leedy, Antonio Crespo, Steve Tetlak
2017 IEEE COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT SYMPOSIUM (CSICS)
(2017)
Proceedings Paper
Optics
Michael L. Schuette, Andrew J. Green, Kevin D. Leedy, Jonathan P. McCandless, Gregg H. Jessen
OXIDE-BASED MATERIALS AND DEVICES VIII
(2017)
Article
Physics, Applied
Kevin D. Leedy, Kelson D. Chabak, Vladimir Vasilyev, David C. Look, John J. Boeckl, Jeff L. Brown, Stephen E. Tetlak, Andrew J. Green, Neil A. Moser, Antonio Crespo, Darren B. Thomson, Robert C. Fitch, Jonathan P. McCandless, Gregg H. Jessen
APPLIED PHYSICS LETTERS
(2017)
Article
Physics, Applied
Neil A. Moser, Jonathan P. McCandless, Antonio Crespo, Kevin D. Leedy, Andrew J. Green, Eric R. Heller, Kelson D. Chabak, Nathalia Peixoto, Gregg H. Jessen
APPLIED PHYSICS LETTERS
(2017)