Mechanisms of Sn Hillock Growth in Vacuum by In Situ Nanoindentation in a Scanning Electron Microscope (SEM)

Effect of Grain Size on Pressure-Induced Tin Whisker Formation

(2010) Tadahiro Shibutani   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

Nanoindentation of rare earth–Sn intermetallics in Pb-free solders

(2010) M.A. Dudek et al.   INTERMETALLICS

Real-time SEM/FIB studies of whisker growth and surface modification

(2010) Nitin Jadhav et al.   JOM

Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders

(2009) M.A. Dudek et al.   ACTA MATERIALIA

Evaluation of pure tin plated copper alloy substrates for tin whiskers

(2009) Sony Mathew et al.   CIRCUIT WORLD

Indentation-induced tin whiskers on electroplated tin coatings

(2008) Fuqian Yang et al.   JOURNAL OF APPLIED PHYSICS