In Situ Measurement of Stress and Whisker/Hillock Density During Thermal Cycling of Sn Layers

出版年份 2013 全文链接

标题

作者

关键词

Pb-free manufacturing, tin whiskers, thermal cycling, reliability

出版物

Volume 43, Issue 1, Pages 80-87

出版商

Springer Nature

发表日期

2013-11-19

DOI

10.1007/s11664-013-2878-3

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