Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking the Effect of Pb to Suppress Whiskers

Effect of layer properties on stress evolution, intermetallic volume, and density during tin whisker formation

(2011) Eric Chason et al.   JOM

Stress Relaxation in Sn-Based Films: Effects of Pb Alloying, Grain Size, and Microstructure

(2011) Nitin Jadhav et al.   JOURNAL OF ELECTRONIC MATERIALS

Understanding the Correlation Between Intermetallic Growth, Stress Evolution, and Sn Whisker Nucleation

(2010) Nitin Jadhav et al.   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

Real-time SEM/FIB studies of whisker growth and surface modification

(2010) Nitin Jadhav et al.   JOM

Stress behavior of electroplated Sn films during thermal cycling

(2009) Jae Wook Shin et al.   JOURNAL OF MATERIALS RESEARCH

Driving force for Sn whisker growth in the system Cu–Sn

(2008) M. Sobiech et al.   APPLIED PHYSICS LETTERS

Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes

(2008) E. Chason et al.   APPLIED PHYSICS LETTERS