Engineering the mechanical properties of ultrabarrier films grown by atomic layer deposition for the encapsulation of printed electronics
出版年份 2015 全文链接
标题
Engineering the mechanical properties of ultrabarrier films grown by atomic layer deposition for the encapsulation of printed electronics
作者
关键词
-
出版物
JOURNAL OF APPLIED PHYSICS
Volume 118, Issue 8, Pages 085501
出版商
AIP Publishing
发表日期
2015-08-29
DOI
10.1063/1.4928855
参考文献
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