Effect of Substrate Composition on Whisker Growth in Sn Coatings

Evidence of 3D strain gradients associated with tin whisker growth

(2018) Johan Hektor et al.   SCRIPTA MATERIALIA

Manipulating Crystallographic Texture of Sn Coatings by Optimization of Electrodeposition Process Conditions to Suppress Growth of Whiskers

(2015) Piyush Jagtap et al.   JOURNAL OF ELECTRONIC MATERIALS

An Investigation into Zinc Diffusion and Tin Whisker Growth for Electroplated Tin Deposits on Brass

(2014) Mark A. Ashworth et al.   JOURNAL OF ELECTRONIC MATERIALS

Microstructural Development and Possible Whiskering Behavior of Thin Sn Films Electrodeposited on Cu(Zn) Substrates

(2014) J. Stein et al.   JOURNAL OF ELECTRONIC MATERIALS

Selective Formation of Carbon-Coated, Metastable Amorphous ZnSnO3Nanocubes Containing Mesopores for Use as High-Capacity Lithium-Ion Battery

(2014) Fei Han et al.   Small

NiSn4 Formation in As-Soldered Ni-Sn and ENIG-Sn Couples

(2012) S. A. Belyakov et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of layer properties on stress evolution, intermetallic volume, and density during tin whisker formation

(2011) Eric Chason et al.   JOM

Effect of intermetallic growth rate on spontaneous whisker growth from a tin coating on copper

(2011) Alongheng Baated et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Growth Behavior of Meta-Stable ${\rm NiSn}_{3}$ Intermetallic Compound and Its Potential Influence on the Reliability of Electronic Components

(2011) Wan Zhang et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Effect of Substrate Composition on Sn Whisker Growth in Pure Sn Films

(2010) Sarah M. Miller et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE