Effect of layer properties on stress evolution, intermetallic volume, and density during tin whisker formation

Understanding the Correlation Between Intermetallic Growth, Stress Evolution, and Sn Whisker Nucleation

(2010) Nitin Jadhav et al.   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

Real-time SEM/FIB studies of whisker growth and surface modification

(2010) Nitin Jadhav et al.   JOM

The effect of tin grain structure on whisker growth

(2010) Cheng-Fu Yu et al.   MICROELECTRONICS RELIABILITY

Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu6Sn5 Intermetallic Compound

(2009) Eric Buchovecky et al.   JOURNAL OF ELECTRONIC MATERIALS

Stress behavior of electroplated Sn films during thermal cycling

(2009) Jae Wook Shin et al.   JOURNAL OF MATERIALS RESEARCH

Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes

(2008) E. Chason et al.   APPLIED PHYSICS LETTERS