Effect of intermetallic growth rate on spontaneous whisker growth from a tin coating on copper

标题
Effect of intermetallic growth rate on spontaneous whisker growth from a tin coating on copper
作者
关键词
-
出版物
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 22, Issue 11, Pages 1685-1693
出版商
Springer Nature
发表日期
2011-03-25
DOI
10.1007/s10854-011-0346-5

向作者/读者发起求助以获取更多资源

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now