Microstructural Development and Possible Whiskering Behavior of Thin Sn Films Electrodeposited on Cu(Zn) Substrates

Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migration

(2013) P. Sarobol et al.   ACTA MATERIALIA

Aging-time-resolvedin situmicrostructural investigation of tin films electroplated on copper substrates, applying two-dimensional-detector X-ray diffraction

(2013) Jendrik Stein et al.   JOURNAL OF APPLIED CRYSTALLOGRAPHY

Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms

(2013) Eric Chason et al.   PROGRESS IN SURFACE SCIENCE

Stress Relaxation Mechanisms of Sn and SnPb Coatings Electrodeposited on Cu: Avoidance of Whiskering

(2011) M. Sobiech et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of Substrate Composition on Sn Whisker Growth in Pure Sn Films

(2010) Sarah M. Miller et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Local, submicron, strain gradients as the cause of Sn whisker growth

(2009) M. Sobiech et al.   APPLIED PHYSICS LETTERS

Evaluation of pure tin plated copper alloy substrates for tin whiskers

(2009) Sony Mathew et al.   CIRCUIT WORLD

Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging

(2009) Chi-Yang Yu et al.   JOURNAL OF ELECTRONIC MATERIALS

Driving force for Sn whisker growth in the system Cu–Sn

(2008) M. Sobiech et al.   APPLIED PHYSICS LETTERS

Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes

(2008) E. Chason et al.   APPLIED PHYSICS LETTERS