Manipulating Crystallographic Texture of Sn Coatings by Optimization of Electrodeposition Process Conditions to Suppress Growth of Whiskers

An Investigation into Zinc Diffusion and Tin Whisker Growth for Electroplated Tin Deposits on Brass

(2014) Mark A. Ashworth et al.   JOURNAL OF ELECTRONIC MATERIALS

Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migration

(2013) P. Sarobol et al.   ACTA MATERIALIA

Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions

(2013) Jaewon Chang et al.   JOURNAL OF ELECTRONIC MATERIALS

The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

(2011) Thomas R. Bieler et al.   JOURNAL OF ELECTRONIC MATERIALS

Stress Relaxation in Sn-Based Films: Effects of Pb Alloying, Grain Size, and Microstructure

(2011) Nitin Jadhav et al.   JOURNAL OF ELECTRONIC MATERIALS

Whisker Growth Behavior of Sn and Sn Alloy Lead-Free Finishes

(2011) Alongheng Baated et al.   JOURNAL OF ELECTRONIC MATERIALS

Atomistic modeling of β-Sn surface energies and adatom diffusivity

(2010) Michael S. Sellers et al.   APPLIED SURFACE SCIENCE

Defect Morphology and Texture in Sn, Sn–Cu, and Sn–Cu–Pb Electroplated Films

(2010) Pylin Sarobol et al.   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

Local, submicron, strain gradients as the cause of Sn whisker growth

(2009) M. Sobiech et al.   APPLIED PHYSICS LETTERS

Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition

(2009) Meng Liu et al.   JOURNAL OF ELECTRONIC MATERIALS

Driving force for Sn whisker growth in the system Cu–Sn

(2008) M. Sobiech et al.   APPLIED PHYSICS LETTERS

Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes

(2008) E. Chason et al.   APPLIED PHYSICS LETTERS

The effect of postbake treatment on whisker growth under high temperature and humidity conditions on tin-plated Cu substrates

(2007) Kyung-Seob Kim et al.   MATERIALS LETTERS