Nano-grinding process of single-crystal silicon using molecular dynamics simulation: Nano-grinding parameters effect

Towards understanding the machining mechanism of the atomic force microscopy tip-based nanomilling process

(2021) Jiqiang Wang et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Molecular dynamics simulations of scratching characteristics in vibration-assisted nano-scratch of single-crystal silicon

(2021) Yue Chen et al.   APPLIED SURFACE SCIENCE

Effect of abrasive particle shape on the development of silicon substrate during nano-grinding

(2021) Yuhua Huang et al.   COMPUTATIONAL MATERIALS SCIENCE

Study on the vertical ultrasonic vibration-assisted nanomachining process on single-crystal silicon

(2021) Jiqiang Wang et al.   JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME

Material removal mechanism of FCC single-crystalline materials at nano-scales: Chip removal & ploughing

(2021) Huan Liu et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Numerical investigation on subsurface damage in nanometric cutting of single-crystal silicon at elevated temperatures

(2021) Changlin Liu et al.   Journal of Manufacturing Processes

Molecular dynamics simulation study of interaction mechanism between grain boundaries and subgrain boundaries in nano-cutting

(2021) Pengyue Zhao et al.   Journal of Manufacturing Processes

Processing outcomes of atomic force microscope tip-based nanomilling with different trajectories on single-crystal silicon

(2021) Jiqiang Wang et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Sensitivity analysis of the surface integrity of monocrystalline silicon to grinding speed with same grain depth-of-cut

(2020) Ping Zhou et al.   Advances in Manufacturing

Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding

(2017) Ping Zhou et al.   JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME

Molecular dynamics study on the thickness of damage layer in multiple grinding of monocrystalline silicon

(2016) Xiaoguang Guo et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Subsurface damage mechanism of high speed grinding process in single crystal silicon revealed by atomistic simulations

(2015) Jia Li et al.   APPLIED SURFACE SCIENCE

Warping of silicon wafers subjected to back-grinding process

(2015) Shang Gao et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Designing nanostructured Si anodes for high energy lithium ion batteries

(2012) Hui Wu et al.   Nano Today

Phase transformation of single crystal silicon induced by grinding with ultrafine diamond grits

(2010) Zhenyu Zhang et al.   SCRIPTA MATERIALIA

Possibility of high-pressure transformation during nanoindentation of SiC

(2009) Maneesh Mishra et al.   ACTA MATERIALIA

Visualization and analysis of atomistic simulation data with OVITO–the Open Visualization Tool

(2009) Alexander Stukowski   MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING

Force modeling of micro-grinding incorporating crystallographic effects

(2008) Hyung Wook Park et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Enhanced thermoelectric performance of rough silicon nanowires

(2008) Allon I. Hochbaum et al.   NATURE

Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining

(2008) Jiwang Yan et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY