标题
2D materials inks toward smart flexible electronics
作者
关键词
2D materials, Flexible electronics, Ink formulation process, Post-treatment, Smart applications
出版物
Materials Today
Volume 50, Issue -, Pages 116-148
出版商
Elsevier BV
发表日期
2021-10-22
DOI
10.1016/j.mattod.2021.08.010
参考文献
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