Perspective on thermal conductance across heterogeneously integrated interfaces for wide and ultrawide bandgap electronics

标题
Perspective on thermal conductance across heterogeneously integrated interfaces for wide and ultrawide bandgap electronics
作者
关键词
-
出版物
APPLIED PHYSICS LETTERS
Volume 120, Issue 3, Pages 030501
出版商
AIP Publishing
发表日期
2022-01-18
DOI
10.1063/5.0077039

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