Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices

标题
Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices
作者
关键词
-
出版物
ACS Applied Materials & Interfaces
Volume 12, Issue 7, Pages 8376-8384
出版商
American Chemical Society (ACS)
发表日期
2020-01-28
DOI
10.1021/acsami.9b16959

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