Emerging challenges and materials for thermal management of electronics

标题
Emerging challenges and materials for thermal management of electronics
作者
关键词
-
出版物
Materials Today
Volume 17, Issue 4, Pages 163-174
出版商
Elsevier BV
发表日期
2014-04-24
DOI
10.1016/j.mattod.2014.04.003

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