Thermal Management of GaN-on-Si High Electron Mobility Transistor by Copper Filled Micro-Trench Structure
出版年份 2019 全文链接
标题
Thermal Management of GaN-on-Si High Electron Mobility Transistor by Copper Filled Micro-Trench Structure
作者
关键词
-
出版物
Scientific Reports
Volume 9, Issue 1, Pages -
出版商
Springer Science and Business Media LLC
发表日期
2019-12-23
DOI
10.1038/s41598-019-56292-3
参考文献
相关参考文献
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