Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag.,145(2), p. 021005)

标题
Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag.,145(2), p. 021005)
作者
关键词
-
出版物
JOURNAL OF ELECTRONIC PACKAGING
Volume 146, Issue 1, Pages -
出版商
ASME International
发表日期
2023-09-30
DOI
10.1115/1.4063546

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