Formation and characterization of low resistivity sub-100nm copper films deposited by electroless on SAM

Published 2009 View Full Article

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Title
Formation and characterization of low resistivity sub-100nm copper films deposited by electroless on SAM
Authors
Keywords
-
Journal
ELECTROCHIMICA ACTA
Volume 54, Issue 25, Pages 6053-6057
Publisher
Elsevier BV
Online
2009-03-12
DOI
10.1016/j.electacta.2009.02.089

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